Surface Profiler

Step Profiler (Surface Profiler)

Surface Profiler

Operating

Model：	P7
Function：	1. Step and trench depth measurement within the allowable range of the probe; 2. Thickness measurement of various deposited thin films; 3. Surface roughness measurement.
Engineer：	Qu; Fu / +86-21- 34207734-8003 / 34206126-6010 / minni.qu@1; xuecheng.f@1
Location：	East Area – Thin Film IV, West Area – Thin Film IA
Equipment ID：	EFM3SP701、WF1KSPR01

Reservation

Basic Equipment Information
Operating Principle
Typical Application Case

Main Application

It is mainly used for the depth measurement of steps and trenches. It features high measurement accuracy and good repeatability, and can be applied to the thickness testing of organic thin films.

Process/Testing Capabilities

It can be used to measure step height, thin film surface roughness and other parameters, covering the characterization of thin films and patterns in various technological processes including semiconductor wet processing, lithography patterning, thin film growth and etching, as well as packaging.

Technical Specifications

Motorized automatic stage with closed-loop automatic travel range of 150mm × 150mm.
Vertical measurement range within 1000 μm for trench and step measurement.
Ultra-low force sensor with adjustable force from 0.5 mg to 50 mg.
Substrate size: compatible with 5-inch, 4-inch, 3-inch and fragments below 6 inches.
Step height measurement repeatability: 4 Å (≤ 1 μm) or 0.10% (> 1 μm).

The probe makes direct contact with the sample and moves across its surface. As the probe contacts the sample surface, it moves vertically up and down following the surface undulations. The step profiler measures the surface topography of the sample by detecting the vertical displacement of the probe. The lateral movement of the probe is controlled by a high-precision motor, and surface profile data is generated and recorded from the vertical motion of the probe.

Step Sample Test (Sampling Rate: 100Hz, Scanning Speed: 50μm/s)

1. Testing of contaminated samples such as powder and undried glue is prohibited.

2. The size of test samples shall be less than 6 inches.

3. The step height of test samples shall be less than 1000 μm.

(1) Do not open the front window while the sample stage or measuring head is in motion.

(2) When loading or unloading samples, only the sample stage and front window are allowed to be touched; contact with any other internal parts of the equipment is prohibited.

(3) When lowering the probe under the "Focus" function, if the operator anticipates emergency risks such as probe position deviation or probe collision, immediately press the Esc key on the keyboard to stop the probe descent.

(4) When scanning the edge of the sample, set the scanning direction from the inside of the sample toward the outer edge; avoid starting the scan from a suspended position.

(5) When the step height is greater than 50 μm, scan downward from the upper side of the step to the lower side.

(6) If it is necessary to measure samples that are thinner, thicker, larger, smaller, or extremely uneven compared with standard 3–6 inch wafers, please contact the process person in charge for assistance.

(7) In case of software error prompts during operation, take a screenshot for timely preservation and contact the process person in charge.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

The sample stage cannot be moved either by clicking the microscope field of view with the mouse or using the arrows on the toolbar, and an error message appears in the information bar at the lower left of the software.

Cause of Abnormality

The interlock is triggered, causing the system to automatically cut off the software's control over the moving parts.

Troubleshooting Methods

(1) Check whether the front window is properly closed. Open and gently close the front window again, then try moving the sample stage once more.

(2) Check whether the front, rear, left and right panels of the equipment are loose. Contact the process person in charge if any looseness is found.

(3) If the above operations fail to resolve the fault, please contact the process person in charge.

Message Inquiry

If your question is not listed above, please email us at [email protected] or click the button below to submit an inquiry.

Email Inquiry