FSM Film Stress Measurement System

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Thin Film Stress Tester

Operating

Model：	500TC
Function：	1. Substrate thin film stress measurement (Note: Measurement is required once before and once after thin film deposition);2. Thin film stress measurement with temperature rising from room temperature to 500℃.
Engineer：	Liu / +86-21- 34206126-6013 / minliu@1
Location：	West Area – Thin Film II
Equipment ID：	WF2FSTR01

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Basic Equipment Information
Operating Principle
Typical Application Case

Main Application

The thin film stress tester adopts a non-contact laser scanning method to measure the curvature change of wafers before and after coating, and calculates the thin film stress by the Stoney formula. It is mainly used for stress detection of semiconductor thin films.

Process/Testing Capabilities

The thin film stress is calculated by measuring the curvature change of the substrate before and after thin film deposition.

Technical Specifications

Only intact wafers of 8 inches and below are accepted, with reflective sample surface required.

The basic principle of thin film stress measurement is to calculate the thin film stress by measuring the curvature change of the substrate after thin film deposition.When a thin film is deposited on the substrate, internal stress is generated due to the difference in physical properties between the substrate and the thin film. This stress causes a slight deformation of the substrate, especially a change in curvature. By measuring such curvature variation, the internal stress state of the thin film can be reflected indirectly.

Stress Measurement Results of 4-inch Wafer Samples After Coating

Accepts intact wafers of 2/3/4/6/8 inches. Broken pieces, irregular-shaped samples, and low-reflectivity samples (such as frosted thin films) are not allowed.

Temperature rise measurement shall be specified in advance.

1. Intact wafers of 2/3/4/6/8 inches are accepted. Keep the backside of samples clean, and close the software after use.

2. Pay attention to the hydraulic device when placing samples to avoid finger pinching injuries.

3. Do not touch the equipment or operating computer during operation, so as to prevent accidental contact from causing equipment shutdown or malfunction.

4. In case of equipment alarm, please notify the corresponding equipment engineer immediately.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Can the thin film stress tester measure broken wafer pieces?

No. The platform stress tester only accepts intact wafers.

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