| Model： | Custom |
|---|---|
| Function： | Used for metal wet etching processes for wafers up to 8 inches. Each tank can process up to 5 wafers simultaneously. Supports wet etching and cleaning of different metal thin films using aluminum etching, chromium etching, and SC1 solutions. |
| Engineer： | Li / +86-21- 34206126-6015 / lijinxi@1 |
| Location： | East Area – Inorganic Wet Process IVA |
| Equipment ID： | EIM4NME01 |
This system is designed for metal and dielectric wet etching and cleaning processes for wafers sized 6–8 inches and 3–4 inches. It is equipped with two sets of tanks of different sizes, each capable of processing up to 5 wafers per batch. Chemical solutions such as phosphoric acid, SPM, and DHF are used for dielectric etching and cleaning processes.
Process / Testing Capabilities
Processes up to 5 wafers (≤8 inches) per batch. Supports wet etching of different metal films using aluminum etchant, chromium etchant, and SC1 solution. Enables multi-step wet chemical processing for metal thin films.
Technical Specifications
1. Dimensions: approximately 1800 (L) × 1200 (W) × 2000 (H) mm;
2. Working surface: 1600 × 900 mm; constructed with 12 mm PP (polypropylene) white panel;
3. Tank size: 225 (L) × 100 (W) × 250 (H) mm.
Address: 800 Dongchuan Road, Minhang District, Shanghai 200240, China
Tel: +86 21 3420 7734
Email: [email protected]
