Non-CMOS Metal RCA Cleaning Station

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Operating

Model：	Custom
Function：	This system is equipped with two sets of tanks of different sizes, designed for metal wet etching and cleaning processes for 6–8 inch and 3–4 inch wafers. Each tank can process up to 5 wafers simultaneously. The system utilizes SC2 and DHF solutions to perform various steps of metal wet etching and cleaning.
Engineer：	Li / +86-21- 34206126-6015 / lijinxi@1
Location：	East Area – Inorganic Wet Process IVA
Equipment ID：	EIM4NMR01

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Basic Equipment Information
Operating Principle

Main Application

This system is designed for metal wet etching and cleaning processes for wafers sized 6–8 inches and 3–4 inches. It is equipped with two different tank sizes, each capable of processing up to 5 wafers per batch. SC2 and DHF solutions are used to complete various cleaning and etching steps.

Process / Testing Capabilities

Processes up to 5 wafers (≤8 inches) per batch.SC2 tank includes heating functionality with adjustable temperature settings. Suitable for removing metal layers from sample surfaces.

Technical Specifications

Temperature control accuracy: ±5°C. Heating rate: 2°C/min. Wafer compatibility: 6–8 inch wafers use 8-inch tanks, 3–4 inch wafers use 4-inch tanks.

Cleaning is achieved through a combination of heated chemical baths and auxiliary functions such as ultrasonic agitation, enabling effective removal of contaminants and metal residues from the sample surface.

Metal film samples can be processed using this equipment.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Can this equipment be operated independently by users?

No. Operation must be performed by authorized process personnel

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