HARRICK Plasma Cleaner

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Plasma Surface Treatment / Cleaning Machine

Operating

Model：	PDC002
Function：	1. Plasma cleaning of substrate surface; 2. Surface modification treatment of substrate (O₂ or N₂).
Engineer：	Fu / +86-21- 34206126-6010 / xuecheng.f@1
Location：	West Area – Thin Film IA
Equipment ID：	WF1HPCL01

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Basic Equipment Information
Operating Principle
Typical Application Case

Main Application

Remove residual photoresist from incomplete development before evaporation or etching, so as to ensure the adhesion of evaporated metal layers and enable smoother etching processes. It can also modify the substrate before spin-coating to achieve more uniform photoresist coating.

Process / Testing Capabilities

Three power levels are optional, with the power ranges as follows:

Low power level: 716 V DC voltage, 10 mA DC current, operating power of 7.16 W, compliant with requirements.
Medium power level: 720 V DC voltage, 15 mA DC current, operating power of 10.15 W, compliant with requirements.
High power level: 740 V DC voltage, 40 mA DC current, operating power of 29.6 W.

Technical Specifications

Cleaning chamber dimensions: length 6.5 inches (165 mm), diameter 6 inches (152 mm), with an openable chamber cover.
Suitable for surface treatment of 6-inch silicon wafers; the maximum residual photoresist removal rate is 4 nm/min.

The working principle of the plasma cleaner is mainly based on the physical and chemical effects of plasma. In a vacuum chamber, a radio frequency power supply generates high-energy plasma carrying positive and negative charges, which forms electric and magnetic fields. The plasma collides with the material surface to bombard and strip off contaminants for cleaning. Meanwhile, plasma reacts chemically with the surface to produce volatile by-products, achieving further removal of contaminants.

Low power enables rapid and efficient substrate surface treatment, while effectively protecting the base material. The figure shows the hydrophilicity and hydrophobicity comparison of silicon wafers before and after modification.

Before modification

After modification

Samples larger than 6 inches are not acceptable.Cleaning and stripping of thick photoresist are not supported.

It generates glow discharge ionizing radiation and requires standardized operation.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

No glow discharge appears long after power-on.

Check whether the chamber door is tightly closed, as it may be loose.

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