303DU hotplate

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Ordinary hot plate

303DU hotplate

Operating

Model：	303DU hotplate
Function：	Photoresist baking.
Engineer：	Wang,Zhang / +86-21- 34206126-6005/6029 / fdwang@1/captianzhangdi@1
Location：	East Area – Lithography IIIA, West Area – Lithography I
Equipment ID：	ELT3PHP01、ELT3PHP02、ELT3PHP03、ELT3PHP04、WPHDHTP01、EPHSHTP01、EODBHTP01

Reservation

Basic Equipment Information

Main Application

Photoresist baking.

Process / Testing Capabilities

Photoresist baking.

Technical Specifications

Temperature Range: Ambient Temperature – 250°C
Temperature Accuracy: ≤ ± 1%

Standard semiconductor silicon wafers or glass wafers, sample size ≤ 8".

Inspect the equipment status prior to use and exercise caution when placing samples to avoid scalding by the hot plate that has not cooled down completely from the previous use. The photoresist on the edges and back of the sample must be thoroughly removed before placing the sample on the hot plate for thermal processing, to prevent contamination of the hot plate by residual photoresist. Scraping or scratching the coating on the hot plate surface with hard materials such as metal is strictly prohibited. Turn off the hot plate in a timely manner after use.

The list below shows FAQs (click a question to view the answer). If your question is not listed, you can leave a message using the link.

FAQs

01

Garbled display on the equipment after startup

Restart the equipment

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