• Model:ACT8

    Status: Operating

    Function:Fully automatic coating and developing for 180 nm semiconductor process node.

    East Area – Lithography II (Canon)+86-21-34206126-6052
  • Model:101 Spray Coater

    Status: Operating

    Function:Photoresist spin coating and spray coating in semiconductor lithography processes.

    East Area – Lithography IIIA+86-21-34206126-6005
  • Model:RCD8

    Status: Operating

    Function:Photoresist spin coating for wafers up to 8 inches.

    East Area – Lithography IIIA+86-21-34206126-6005
  • Model:SM-200

    Status: Operating

    Function:Primarily used for the spin coating process in photolithography; enables uniform coating of photoresist or other liquid materials, suitable for high-precision coating on wafers and substrates.

    East Area – Lithography IIIA+86-21-34206126-6029
  • Model:Spin-coater

    Status: Operating

    Function:1.Photoresist spin coating ; 2.Spin coating of flexible substrate precursor materials.

    East Area – Lithography IIIA, West Area – Lithography I+86-21- 34206126-6005/6029
  • Model:RCD8

    Status: Operating

    Function:Spray-type development.

    East Area – Lithography IIIA+86-21- 34206126-6005
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