1. Mainly used for spin coating in photolithography processes;

2. Capable of uniformly coating photoresist, electron beam resist, bio-coatings, or other functional liquid materials;

3. Suitable for high-uniformity coating of wafers (1–8 inches) and special substrates.

Process / Testing Capabilities

1. Compatible with 1–8 inch wafers, supports multiple size configurations;

2. Equipped with automatic spin coating, automatic/manual dispensing, and manual loading/unloading;

3. Adjustable process parameters: spin speed, acceleration, time, and rotation direction;

4. Supports coating uniformity testing, edge bead removal (EBR), and backside rinse verification.

Technical Specifications

1. Supports spin coating for wafers of 1/2/3/4/5/6/7/8 inches;

2. Manual wafer loading/unloading; automatic dispensing (switchable to manual),automatic spin coating;

3. Spin speed range: 0–6000 rpm; acceleration reaches 6000 rpm within 0.6 seconds;

4. Speed control accuracy: ±1 rpm; rotation direction: clockwise and counterclockwise;

5. Supports edge bead removal (EBR) and backside rinse functions.