1. Used for wafer thermal processing in photolithography, including photoresist soft bake (post-coating bake) and post-exposure bake;  

2. Applicable to other temperature-controlled thermal processes such as material curing and stress relief;  

3. Supports wafers up to 8 inches and smaller sizes.

1. Supports various temperature settings for soft bake and post-bake process optimization;  

2. Adjustable proximity distance between wafer and hotplate to evaluate heat transfer efficiency and baking uniformity;  

3. Enables evaluation of thermal effects on pattern resolution, edge integrity, photoresist adhesion, and thermal stability;  

4. Suitable for process window development, validation, and parameter optimization;  

5. Supports multi-size wafer processing up to 8 inches for research and pilot-scale applications.

1. Temperature range: 0°C to 250°C; 

2. Temperature accuracy: ±0.6°C at 100°C; 

3. Operating mode: proximity heating; gap adjustable from 0–8 mm via pins; 

4. Wafer compatibility: up to 8 inches, compatible with smaller sizes.