Chemical Vapor Deposition (CVD)

Physical Vapor Deposition (PVD)

Sputtering, electron beam evaporation, thermal evaporation, IBD (Ion Beam Deposition)

Metals (Al/Cu), oxides (Ta₂O₅)

Seed layers for high-aspect-ratio structures (TSV/TGV); functional thin films (e.g., V₂O₅).

Atomic Layer Deposition (ALD)

Thermal ALD, plasma-enhanced ALD (PEALD)

High-k dielectrics (HfO₂), ferroelectric thin films

Atomic-level thickness control with excellent step coverage, suitable for nanoscale devices.

Piezoelectric Thin Film Deposition

Multi-chamber system (Mo/AlN/AlScN/planarization)

AlScN multilayer piezoelectric stack

High-performance piezoelectric devices (e.g., MEMS sensors), supporting simultaneous deposition of multiple materials.

Organic Molecular Deposition

Surface modification, Parylene deposition

Superhydrophobic/hydrophilic coatings, encapsulation films

High biocompatibility, used for functionalized surfaces or device protection (e.g., flexible electronics).

Thermal Oxidation

Dry and wet thermal oxidation

SiO₂ oxide layer

Semiconductor insulating layer formed via high-temperature processes (requires a silicon substrate).

Low-Temperature Carbon Material Growth

Graphene, carbon nanotubes (CNTs)

Low-temperature (<500 °C) growth, compatible with flexible substrates, used for sensors or conductive materials.

Molecular Beam Epitaxy (MBE)

Solid-source / gas-source MBE

SiGe, III-V compounds (GaAs/InP)

Ultra-high vacuum environment with atomic-scale epitaxial control; used for high-speed electronic and optoelectronic devices (e.g., lasers).