Dielectric reactive ion etching: SiO₂, SiNₓ, glass, quartz, etc.
Metal reactive ion etching: Al, Ti and other metals, polycrystalline silicon, LNO, LTO, etc.
Deep Reactive Ion Etching (DRIE): Bosch deep silicon etching for TSVs, as well as shallow silicon etching and silicon waveguides.
High-aspect-ratio etching of dielectrics, quartz, lithium niobate (LiNbO₃), and lithium tantalate (LiTaO₃).
Anisotropic ion beam etching: metals, 2.5D structures, and blazed gratings.
Laser-Induced Glass Etching (TGV)
Isotropic chemical etching: VHF SiO₂ etching and XeF₂ silicon etching.
Address: 800 Dongchuan Road, Minhang District, Shanghai 200240, China
Tel: +86 21 3420 7734
Email: [email protected]
