Function：1.The equipment is equipped with a stainless steel ultrasonic tank (300×300 mm), which enables water bath heating and ultrasonic functions for samples; 2.There are no special restrictions on substrates and their surface materials; 3.The equipment can be externally connected to small desktop devices such as heating and ultrasonic units to realize flexible processing; 4.It is suitable for processing small and broken samples.

Function：1.This equipment is equipped with tanks for SPM, SC1, SC2, HF and QDR processes, including one set of large tank (suitable for 4-inch silicon wafer processing) and one set of small tank (suitable for 3-inch silicon wafer processing); 2.It can be used for standard RCA cleaning processes, and individual tanks can also be used independently for cleaning processes in micro-nano fabrication.

Function：Non-destructive drying of samples with complex and fine structures

Function：Capable of automated spin drying for one cassette of 4-inch or 6-inch wafers (up to 25 wafers per batch).Wafers are first rinsed with deionized (DI) water, followed by high-speed spin drying using high-purity nitrogen (N₂).

Function：1.Nitrogen-protected oven 2.Process temperature range: 0–300 °C, adjustable The system is programmable, enabling control of temperature ramp rates, dwell time, and other process parameters, with fully automated recipe execution.