Optical Communication Device & Chip Fabrication - Process Integration - Process Capabilities

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Process Integration

Optical Communication Device & Chip Fabrication

Optical Communication Device & Chip Fabrication
Novel Nanoelectronic / Optoelectronic Devices
CMOS Processes
Micro-Nano Optical Device Fabrication
MEMS / Microfluidic Chip Fabrication
Heterogeneous Integrated Advanced Packaging

Optical Communication Device & Chip Fabrication
Novel Nanoelectronic / Optoelectronic Devices
CMOS Processes
Micro-Nano Optical Device Fabrication
MEMS / Microfluidic Chip Fabrication
Heterogeneous Integrated Advanced Packaging

Fabrication Processes for Optical Communication Devices and Integrated Photonic Chips

The platform provides existing silicon-based active/passive device PDK process libraries, with standard fabrication capabilities for silicon photonic waveguide devices, and also supports customized fabrication of silicon, silicon nitride, and lithium niobate devices.

Figure 1. Schematic of the AEMD silicon photonic passive device PDK platform.

Process Integration Workflow

Figure 2. Existing silicon photonic device fabrication processes and testing categories of the platform.