MEMS / Microfluidic Chip Fabrication - Process Integration - Process Capabilities

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Process Integration

MEMS / Microfluidic Chip Fabrication

Optical Communication Device & Chip Fabrication
Novel Nanoelectronic / Optoelectronic Devices
CMOS Processes
Micro-Nano Optical Device Fabrication
MEMS / Microfluidic Chip Fabrication
Heterogeneous Integrated Advanced Packaging

Optical Communication Device & Chip Fabrication
Novel Nanoelectronic / Optoelectronic Devices
CMOS Processes
Micro-Nano Optical Device Fabrication
MEMS / Microfluidic Chip Fabrication
Heterogeneous Integrated Advanced Packaging

MEMS/Microfluidic Chip Fabrication

The platform currently has full fabrication capabilities for MEMS and microfluidic chips, enabling the development of planar, bulk, and complex 3D structures on commonly used substrates such as silicon, glass, and flexible materials.

Flow Cytometry Cell Sorting Chip

(Figure provided by: Prof. Xiang Chen’s research group, Shanghai Jiao Tong University)

Metal-based MEMS inertial switch sensor

(Figure provided by: Prof. Zhuoqing Yang’s research group, Shanghai Jiao Tong University)